International Patent: THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SYMMETRIC ARRAY CONNECTION STRIPS AND METHODS FOR FORMING THE SAME

GENEVA, July 2 -- SANDISK TECHNOLOGIES, INC. filed a patent application (US2025/026171) for “THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SYMMETRIC ARRAY CONNECTION STRIPS AND METHODS FOR FORMING THE SAME”. With publication no. WO/2026/135725, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10B 43/35

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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