INTERNATIONAL PATENT: THINKON NEW TECHNOLOGY JAPAN CORPORATION, 日本新工芯技株式会社 FILES APPLICATION FOR "SILICON JOINT BODY MANUFACTURING DEVICE, SILICON JOINT BODY MANUFACTURING METHOD AND SILICON JOINT BODY"

GENEVA, Sept. 17 -- THINKON NEW TECHNOLOGY JAPAN CORPORATION (30-10, Toyotamakita 4-chome, Nerima-ku, Tokyo1760012), 日本新工芯技株式会社 (東京都練馬区豊玉北四丁目３０番１０号) filed a patent application (PCT/JP2025/007657) for "SILICON JOINT BODY MANUFACTURING DEVICE, SILICON JOINT BODY MANUFACTURING METHOD, AND SILICON JOINT BODY" on Mar 04, 2025. With publication no. WO/2025/187678, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is ...