GENEVA, June 19 -- DIC CORPORATION filed a patent application (JP2025/038867) for “THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING AGENT, SEMICONDUCTOR DEVICE, INSULATING MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD”. With publication no. WO/2026/105646, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 101/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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