GENEVA, Oct. 5 -- OSAKA SODA CO., LTD. filed a patent application (JP2026/004716) for “THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND MOLDED ARTICLE”. With publication no. WO/2026/203878, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 31/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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