International Patent: THERMOPLASTIC SEMI-CONDUCTIVE SHIELDING MATERIAL, PREPARATION METHOD THEREFOR AND USE THEREOF

GENEVA, Oct. 30 -- ELECTRIC POWER RESEARCH INSTITUTE. CHINA SOUTHERN POWER GRID filed a patent application (CN2025/121234) for “THERMOPLASTIC SEMI-CONDUCTIVE SHIELDING MATERIAL, PREPARATION METHOD THEREFOR AND USE THEREOF”. With publication no. WO/2026/222946, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 18/66

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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