International Patent: THERMOELECTRIC ELEMENT INCLUDING DIFFUSION BARRIER LAYER AND HOME APPLIANCE INCLUDING SAME

GENEVA, July 2 -- SAMSUNG ELECTRONICS CO., LTD. filed a patent application (KR2025/016932) for “THERMOELECTRIC ELEMENT INCLUDING DIFFUSION BARRIER LAYER AND HOME APPLIANCE INCLUDING SAME”. With publication no. WO/2026/134612, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10N 10/13

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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