GENEVA, Oct. 5 -- HENKEL AG & CO. KGAA filed a patent application (CN2025/084577) for “THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION AND ELECTRONIC DEVICE USING THE SAME”. With publication no. WO/2026/199145, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C10M 169/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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