GENEVA, Oct. 9 -- FUJI POLYMER INDUSTRIES CO., LTD. filed a patent application (JP2025/034938) for “THERMALLY CONDUCTIVE FILLER, THERMALLY CONDUCTIVE COMPOSITION, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE FILLER”. With publication no. WO/2026/210853, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09C 3/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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