GENEVA, July 2 -- SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) filed a patent application (US2025/056065) for “THERMAL CONNECTIONS WITHIN A DEVICE ENCLOSURE TO IMPROVE THERMAL DISSIPATION”. With publication no. WO/2026/135907, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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