GENEVA, Sept. 9 -- THE UNIVERSITY OF TOKYO (3-1, Hongo 7-chome, Bunkyo-ku, Tokyo1138654), 国立大学法人 東京大学 (東京都文京区本郷七丁目3番1号), TOYOBO CO., LTD. (13-1, Umeda 1-chome, Kita-ku, Osaka-shi, Osaka5300001), 東洋紡株式会社 (大阪府大阪市北区梅田一丁目13番1号) filed a patent application (PCT/JP2025/006428) for "MICRONEEDLE PATCH PROVIDED WITH POROUS MICRONEEDLES, AND METHOD FOR MANUFACTURING SAID MICRONEEDLE PATCH" on Feb 25, ...
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