INTERNATIONAL PATENT: THE UNIVERSITY OF CHICAGO FILES APPLICATION FOR "METHOD FOR CONTROLLED SPALLING OF HIGH FRACTURE TOUGHNESS MATERIALS"

GENEVA, April 20 -- THE UNIVERSITY OF CHICAGO (5801 South Ellis AvenueChicago, IL 60637) filed a patent application (PCT/US2024/050097) for "METHOD FOR CONTROLLED SPALLING OF HIGH FRACTURE TOUGHNESS MATERIALS" on Oct 04, 2024. With publication no. WO/2026/080057, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HORN, Connor, P. (740 South Federal Street, Apt. 809Chicago, IL 60605), GUHA, Supratik (4829 S. Kimbark AvenueChicago, IL 60615)

Abstract: The disclosure is directed to methods for spalling a substrate, products ma...