INTERNATIONAL PATENT: THE GOODSYSTEM CORP., 주식회사 더굿시스템, COMPOUND SEMICONDUCTOR(XIAMEN) TECHNOLOGY CO., LTD., 컴파운드 세미컨덕터(샤먼) 테크놀로지 컴퍼니 리미티드 FILES APPLICATION FOR "HEAT DISSIPATION MEMBER"

Posted On: 2026-01-27

GENEVA, Jan. 27 -- THE GOODSYSTEM CORP. (125, Mongnae-ro, Danwon-guAnsan-siGyeonggi-do 15602), 주식회사 더굿시스템 (경기도안산시단원구 목내로 125), COMPOUND SEMICONDUCTOR(XIAMEN) TECHNOLOGY CO., LTD. (Room 402-17, 56 Chengyi North Street, Software Park Phase 3Ximen City, Fujian 361000), 컴파운드 세미컨덕터(샤먼) 테크놀로지 컴퍼니 리미티드 (복건성샤먼시소프트웨어파크 페이즈 3 청3...

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INTERNATIONAL PATENT: THE GOODSYSTEM CORP., 주식회사 더굿시스템, COMPOUND SEMICONDUCTOR(XIAMEN) TECHNOLOGY CO., LTD., 컴파운드 세미컨덕터(샤먼) 테크놀로지 컴퍼니 리미티드 FILES APPLICATION FOR "HEAT DISSIPATION MEMBER"