INTERNATIONAL PATENT: THE CHINESE UNIVERSITY OF HONG KONG, SHENZHEN, 香港中文大学（深圳） FILES APPLICATION FOR "DEVICE PARAMETER CONFIGURATION METHOD AND APPARATUS, ELECTRONIC DEVICE AND STORAGE MEDIUM"

GENEVA, March 1 -- THE CHINESE UNIVERSITY OF HONG KONG, SHENZHEN (2001 Longxiang Avenue, Longcheng Street, Longgang DistrictShenzhen, Guangdong 518115), 香港中文大学（深圳） (中国广东省深圳市龙岗区龙城街道龙翔大道2001号) filed a patent application (PCT/CN2024/114251) for "DEVICE PARAMETER CONFIGURATION METHOD AND APPARATUS, ELECTRONIC DEVICE AND STORAGE MEDIUM" on Aug 23, 2024. With publication no. WO/2026/040087, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Pate...