INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE INCLUDING A MOLDED INTERCONNECT"

GENEVA, Feb. 11 -- TEXAS INSTRUMENTS INCORPORATED (P.O. Box 655474. Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2025/039416) for "SEMICONDUCTOR PACKAGE INCLUDING A MOLDED INTERCONNECT" on Jul 28, 2025. With publication no. WO/2026/030179, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIBUYA, Makoto (6 Chyome 40-9, ShimoumaLimterrace Alpha Gakugeidaigaku 106Setagaya-ku, 154-0002), KIM, Woochan (860 Midvale LnSan Jose, CA 95136), KIM, Kwang-Soo (888 Pyrus WaySunnyvale, CA 94087)

Abstract: A...