INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "SEMICONDUCTOR DEVICES WITH COMPOSITE DIELECTRIC LAYERS UNDER FIELD PLATES AND METHODS OF FABRICATION THEREOF"

GENEVA, May 12 -- TEXAS INSTRUMENTS INCORPORATED (P. O. Box 655474. Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2025/051772) for "SEMICONDUCTOR DEVICES WITH COMPOSITE DIELECTRIC LAYERS UNDER FIELD PLATES AND METHODS OF FABRICATION THEREOF" on Oct 21, 2025. With publication no. WO/2026/096235, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Dong, Seup (13121 TI BoulevardDallas, TX 75243), KODA, Yasumasa (2 Takaku-KogyodanchiAizuwakamatsu-shi, 965-0060)

Abstract: Semiconductor devices and...