INTERNATIONAL PATENT: TEXAS INSTRUMENTS INCORPORATED FILES APPLICATION FOR "MICROELECTRONICS DEVICE PACKAGE WITH ISOLATION AND CERAMIC INTERPOSER FORMING THERMAL PAD"

GENEVA, Feb. 11 -- TEXAS INSTRUMENTS INCORPORATED (P.o. Box 655474, Mail Station 3999Dallas, TX 75265-5474) filed a patent application (PCT/US2025/040037) for "MICROELECTRONICS DEVICE PACKAGE WITH ISOLATION AND CERAMIC INTERPOSER FORMING THERMAL PAD" on Jul 31, 2025. With publication no. WO/2026/030532, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Woochan (860 Midvale LaneSan Jose, CA 95136), YAN, Yi (3269 Ruskin DriveSan Jose, CA 95132), SHIBUYA, Makoto (6 Chyome 40-9, ShimoumaLimeterrace Alpha Gakugeidaigaku 106...