International Patent: TESTING CORE DIE THROUGH A SCRIBE LANE WITH MECHANICAL STRESS-FREE ACCESS FROM A SEAL RING

GENEVA, July 1 -- QUALCOMM INCORPORATED filed a patent application (US2025/050372) for “TESTING CORE DIE THROUGH A SCRIBE LANE WITH MECHANICAL STRESS-FREE ACCESS FROM A SEAL RING”. With publication no. WO/2026/128073, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 31/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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