INTERNATIONAL PATENT: TENSTORRENT USA, INC. FILES APPLICATION FOR "CHIP-TO-CHIP HIGH SPEED CONNECTION INTERFACE TUNING STRUCTURE"

GENEVA, April 8 -- TENSTORRENT USA, INC. (7717 Southwest Pkwy, Building #3, Suite 200Austin, Texas 78735) filed a patent application (PCT/US2025/046049) for "CHIP-TO-CHIP HIGH SPEED CONNECTION INTERFACE TUNING STRUCTURE" on Sep 12, 2025. With publication no. WO/2026/072338, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GUO, Fei (4816 Dove CourtOttawa, Ontario K1J 9J7)

Abstract: Methods and systems related to chip-to-chip electrical connection interfaces are disclosed. The electrical connections can be formed between ch...