INTERNATIONAL PATENT: TEIJIN LIMITED, 帝人株式会社 FILES APPLICATION FOR "POLYCARBONATE RESIN COMPOSITION AND CIRCUIT MOLDED ARTICLE FOR COMMUNICATION EQUIPMENT"

GENEVA, April 6 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka5300005), 帝人株式会社 (大阪府大阪市北区中之島三丁目２番４号) filed a patent application (PCT/JP2025/022258) for "POLYCARBONATE RESIN COMPOSITION AND CIRCUIT MOLDED ARTICLE FOR COMMUNICATION EQUIPMENT" on Jun 20, 2025. With publication no. WO/2026/069874, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invent...