GENEVA, June 4 -- TDK ELECTRONICS AG (Rosenheimer Str. 141 e81671 Munchen) filed a patent application (PCT/EP2024/080253) for "PACKAGE AND METHOD FOR PRODUCING A PACKAGE" on Oct 25, 2024. With publication no. WO/2025/108655, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOFLER, Johannes (Lendplatz 41, Top 28020 Graz)
Abstract:
The present invention relates to a package comprising a substrate (11) and a MEMS chip (1), the MEMS chip (1) being attached to the substrate (11). A further aspect of the invention relates to ...