GENEVA, Feb. 3 -- TBM CO., LTD. (15th floor, Toho Hibiya Building, 1-2-2, Yurakucho, Chiyoda-ku, Tokyo1000006), 株式会社ＴＢＭ (東京都千代田区有楽町一丁目２番２号 東宝日比谷ビル１５階) filed a patent application (PCT/JP2025/021278) for "RESIN COMPOSITION AND MOLDED ARTICLE CONTAINING SAME" on Jun 12, 2025. With publication no. WO/2026/023272, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is m...