GENEVA, April 7 -- TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (2-3-1, Iwata-cho Higashiosaka-shi, Osaka5788585), タツタ電線株式会社 (大阪府東大阪市岩田町２丁目３番１号) filed a patent application (PCT/JP2025/033794) for "WIRE BONDING METHOD" on Sep 25, 2025. With publication no. WO/2026/070953, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HASEGAWA, Tsuyoshi (c/o TATSUT...