INTERNATIONAL PATENT: TAMURA CORPORATION, 株式会社タムラ製作所 FILES APPLICATION FOR "RESIN FILM, COPPER FOIL WITH RESIN, MULTILAYERED WIRING BOARD, COIL STRUCTURE AND MAGNETIC DEVICE"

GENEVA, April 7 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2025/033084) for "RESIN FILM, COPPER FOIL WITH RESIN, MULTILAYERED WIRING BOARD, COIL STRUCTURE, AND MAGNETIC DEVICE" on Sep 19, 2025. With publication no. WO/2026/070666, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual...