GENEVA, April 7 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2025/033222) for "RESIN COMPOSITION, RESIN FILM, COPPER FOIL WITH RESIN, MULTILAYER WIRING BOARD, COIL STRUCTURE, MAGNETIC DEVICE, AND INSULATED ELECTRIC WIRE" on Sep 19, 2025. With publication no. WO/2026/070703, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...