GENEVA, April 7 -- TAMURA CORPORATION (19-43, Higashi-Oizumi 1-chome, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2025/033489) for "POLYIMIDE, POLYIMIDE FILM, MULTILAYER WIRING BOARD, COPPER FOIL WITH RESIN, COIL STRUCTURE, MAGNETIC DEVICE, AND INSULATED ELECTRICAL WIRE" on Sep 24, 2025. With publication no. WO/2026/070817, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) syst...