GENEVA, Oct. 15 -- QUALCOMM INCORPORATED filed a patent application (US2026/022682) for “SYSTEM-IN-PACKAGE (SIP) CONFIGURED TO RECEIVE MULTIPLE MEMORY DIES”. With publication no. WO/2026/217573, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G11C 5/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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