International Patent: SYSTEM FOR MEASURING THREE-DIMENSIONAL SHAPE OF WAFER AND METHOD THEREFOR

GENEVA, Aug. 14 -- AUROS TECHNOLOGY, INC. filed a patent application (KR2025/018374) for “SYSTEM FOR MEASURING THREE-DIMENSIONAL SHAPE OF WAFER AND METHOD THEREFOR”. With publication no. WO/2026/168683, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01B 11/25

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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