GENEVA, March 30 -- SWISS CLUSTER AG (Bahnhofstrasse 193700 Spiez) filed a patent application (PCT/EP2025/076421) for "MULTILAYER METASURFACE STRUCTURES AND FABRICATION THEREOF" on Sep 16, 2025. With publication no. WO/2026/062001, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHARMA, Amit (c/o Swiss Cluster AGBahnhofstrasse 193700 Spiez), GUERRA, Carlos (c/o Swiss Cluster AGBahnhofstrasse 193700 Spiez)
Abstract: The invention is notably directed to a method of obtaining a multilayer metasurface structure (1). The meth...