International Patent: SUTURING ASSEMBLY INCLUDING A DOUBLE-HEADED CURVED NEEDLE

GENEVA, Aug. 7 -- KING SAUD UNIVERSITY filed a patent application (IB2025/058740) for “SUTURING ASSEMBLY INCLUDING A DOUBLE-HEADED CURVED NEEDLE”. With publication no. WO/2026/162987, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A61B 17/06

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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