GENEVA, July 6 -- INDUSTRY ACADEMIC COOPERATION FOUNDATION OF YEUNGNAM UNIVERSITY filed a patent application (KR2025/022613) for “SUSPENSION COMPOSITION FOR MANUFACTURING THERMOSETTING GRANULES AND HIGH-STRENGTH POWDER MOLDED BODY MANUFACTURED USING SAME”. With publication no. WO/2026/142277, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C04B 35/626
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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