GENEVA, July 9 -- TOKYO ELECTRON LIMITED filed a patent application (JP2025/045151) for “SUBSTRATE PROCESSING DEVICE AND METHOD FOR ASSEMBLING SUBSTRATE PROCESSING DEVICE”. With publication no. WO/2026/146624, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 95/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....