International Patent: SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE SENSING MODULE USED THEREFOR

GENEVA, July 2 -- HPSP CO., LTD. filed a patent application (KR2025/021319) for “SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE SENSING MODULE USED THEREFOR”. With publication no. WO/2026/134990, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 72/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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