International Patent: SUBSTRATE MANUFACTURING SYSTEM, SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE

GENEVA, Sept. 24 -- RESONAC CORPORATION filed a patent application (JP2026/011067) for “SUBSTRATE MANUFACTURING SYSTEM, SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE”. With publication no. WO/2026/197419, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 3/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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