GENEVA, Oct. 9 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION filed a patent application (JP2026/010676) for “SUBSTRATE DEVICE, ELEMENT DEVICE, METHOD FOR MANUFACTURING SUBSTRATE DEVICE, AND METHOD FOR MANUFACTURING ELEMENT DEVICE”. With publication no. WO/2026/211324, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10F 39/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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