GENEVA, July 6 -- RAYMOND, Lam Wai Kin filed a patent application (CN2024/142219) for “SUBSTRATE ASSEMBLY WITH METAL HEAT SINK, AND METHOD FOR MANUFACTURING METAL HEAT SINK”. With publication no. WO/2026/137230, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/498
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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