GENEVA, July 2 -- ZF FRIEDRICHSHAFEN AG filed a patent application (US2025/060294) for “STRAIN RELIEF SYSTEM FOR FLEXBILE CIRCUIT BOARD ASSEMBLY”. With publication no. WO/2026/136658, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....