GENEVA, March 17 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/028857) for "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Aug 18, 2025. With publication no. WO/2026/053713, the details related to the patent application was published on Mar 12, 2026.
Notably, the patent application was submitt...