INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE"

GENEVA, May 11 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/031473) for "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Sep 05, 2025. With publication no. WO/2026/094424, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted u...