GENEVA, April 28 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/029376) for "OPTICAL PACKAGE AND METHOD FOR MANUFACTURING OPTICAL PACKAGE" on Aug 21, 2025. With publication no. WO/2026/083700, the details related to the patent application was published on Apr 23, 2026.
Notably, the patent application was submitted under the International Patent C...