GENEVA, April 6 -- SONY GROUP CORPORATION (1-7-1 KONANMINATO-KU, Tokyo 108-0075), SONY CORPORATION OF AMERICA (25 MADISON AVENUENEW YORK, New York 10010) filed a patent application (PCT/IB2025/058923) for "GENERATION OF ROUGHNESS MAPS FOR THREE-DIMENSIONAL (3D) OBJECTS" on Sep 04, 2025. With publication no. WO/2026/069047, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): FU, Chen (16535 Via EsprilloSan Diego, California 92127), GHARAVI-ALKHANSARI, Mohammad (16535 Via EsprilloSan Diego, California 92127)
Abstract: An elect...