GENEVA, May 19 -- SOLIDSONIC CO., LTD. (6-1-17, Isokami-dori, Chuo-ku, Kobe-shi, Hyogo6510086), ソリッドソニック株式会社 (兵庫県神戸市中央区磯上通６丁目１－１７) filed a patent application (PCT/JP2025/027268) for "BONE CONDUCTION EARPHONE AND METHOD FOR USING BONE CONDUCTION EARPHONE" on Jul 31, 2025. With publication no. WO/2026/100150, the details related to the patent application was published on May 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectu...