International Patent: SLURRY, POLISHING METHOD, METHOD FOR PRODUCING COMPONENT, AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT

GENEVA, Aug. 21 -- RESONAC CORPORATION filed a patent application (JP2025/035490) for “SLURRY, POLISHING METHOD, METHOD FOR PRODUCING COMPONENT, AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT”. With publication no. WO/2026/172583, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09K 3/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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