GENEVA, July 9 -- SHANGHAI SHININGIC ELECTRONIC TECHNOLOGY CO., LTD filed a patent application (CN2025/104946) for “SINGLE-DIE-PAD PACKAGE STRUCTURE AND METHOD FOR ASYNCHRONOUS BUCK CHIP”. With publication no. WO/2026/144049, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/495
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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