International Patent: SINGLE-CHIP MULTISPECTRAL IMAGE SENSOR WITH PEROVSKITE

GENEVA, July 31 -- FUTUREWEI TECHNOLOGIES, INC. filed a patent application (US2026/026486) for “SINGLE-CHIP MULTISPECTRAL IMAGE SENSOR WITH PEROVSKITE”. With publication no. WO/2026/161904, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: H10F 39/18

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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