International Patent: SILICON-CONTAINING COMPOUND, COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

GENEVA, Sept. 24 -- FUJIFILM CORPORATION filed a patent application (JP2026/001792) for “SILICON-CONTAINING COMPOUND, COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/196801, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 16/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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