GENEVA, Jan. 26 -- SIKA TECHNOLOGY AG (Zugerstrasse 506340 Baar) filed a patent application (PCT/EP2025/070245) for "THERMALLY CONDUCTIVE (METH)ACRYLATE ADHESIVE" on Jul 15, 2025. With publication no. WO/2026/017694, the details related to the patent application was published on Jan 22, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): DELGADO, Mabell (c/o Sika Technology AGTuffenwies 168048 Zurich), STORRER, Denise (c/o Sika Technology AGTuffenwies 168048 Zurich)
Abstract: The invention relates to a thermally conductive two-component (meth)acrylate adhesive composition, comprising in a first...