International Patent: SIGNAL ENVELOPE DETECTION CIRCUIT AND CHIP

GENEVA, July 6 -- SHANGHAI ARCHIWAVE MICROELECTRONICS CO. LTD. filed a patent application (CN2025/088560) for “SIGNAL ENVELOPE DETECTION CIRCUIT AND CHIP”. With publication no. WO/2026/137644, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 1/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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