GENEVA, March 9 -- SIEMENS MOBILITY GMBH (Krauss-Maffei-StraBe 280997 Munchen) filed a patent application (PCT/EP2025/074047) for "SEMICONDUCTOR CHIP WITH A FIRMWARE, FIRMWARE AND INDUSTRIAL DEVICE" on Aug 22, 2025. With publication no. WO/2026/046883, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BUDAK, Utku (Cosimastr. 5481927 Munchen), DE SANTIS, Fabrizio (Wendl-Dietrich-Str. 980634 Munchen), FEIST, Christian Peter (Lerchenstr. 1382284 Grafrath)
Abstract: The Semiconductor chip comprises at least a processor (MCUO, ...