INTERNATIONAL PATENT: SIEMENS INDUSTRY SOFTWARE INC. FILES APPLICATION FOR "MACHINE LEARNING-BASED EVALUATION OF BUMP CONFIGURATIONS FOR CIRCUIT DESIGNS"

GENEVA, Feb. 10 -- SIEMENS INDUSTRY SOFTWARE INC. (5800 Granite Parkway, Suite 600Plano, Texas 75024) filed a patent application (PCT/US2024/040270) for "MACHINE LEARNING-BASED EVALUATION OF BUMP CONFIGURATIONS FOR CIRCUIT DESIGNS" on Jul 31, 2024. With publication no. WO/2026/029764, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DON, Dominic (118 Boston Harbour WayMadison, Alabama 35758)

Abstract: Systems and methods are presented for machine learning (ML)-based evaluation of bump configurations. A method may include ...