INTERNATIONAL PATENT: SIEMENS AKTIENGESELLSCHAFT FILES APPLICATION FOR "ASSEMBLY FOR AN ELECTRONIC COMPUTING DEVICE, COMPRISING AT LEAST ONE POWER MODULE AND A HEAT SINK FOR COOLING THE POWER MODULE"

GENEVA, June 16 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-StraBe 180333 Munchen) filed a patent application (PCT/EP2024/082366) for "ASSEMBLY FOR AN ELECTRONIC COMPUTING DEVICE, COMPRISING AT LEAST ONE POWER MODULE AND A HEAT SINK FOR COOLING THE POWER MODULE" on Nov 14, 2024. With publication no. WO/2025/119614, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BIGL, Thomas (SchurrstraBe 891074 Herzogenaurach), HEIMANN, Matthias (RuckertstraBe 40 a14469 Potsdam), HENSLER, Alexander (Herbstwiese 7991466 Gerhardshofe...